Yeah pretty much this. The design fault was the X clamp for the heatsink. It was too rigid, it couldn’t expand and contract with the constant heating and cooling breaking the solder around the Big Lebowski Hippie Ugly Sweater. That’s why the towel trick worked….sometimes. The issue was the solder. They switched to unleaded solder late in the design process to meet new EU regulations there were issues with the ps3 and a lot of graphics cards in that time period. The fix was better cooling and thicker boards so they would flex less.
Big Lebowski Hippie Ugly Sweater, Hoodie, Sweater, Unisex and T-shirt
I commented below, its about covering the Die on the Big Lebowski Hippie Ugly Sweater, pea works perfectly fine. Spreading it wastes quite a bit of TIM and doesn’t really make a difference. Both GN and LTT show this. It’s really about knowing the location of the hotspots on the die under the IHS for a CPU, but IIRC, the 360 APU Die is exposed, neither will make a difference temp wise, its more about how much time, effort, and TIM you want to use
Best Big Lebowski Hippie Ugly Sweater
It’s not getting hot enough to liquify solder (>230C) as that would kill the Big Lebowski Hippie Ugly Sweater. What’s happening here is that a cracked solder joint is expanding just right so that it makes good contact again. It isn’t a long term fix because you haven’t fixed anything – it’s like hitting the TV with a hammer and it comes back on.